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Frame Chip Scale Package - 4x4x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf DFN package size 62x19.5x14mm, https://silvertel.com/images/datasheets/Ag5400-datasheet-high%20Efficiency-30W-Power-Over-Ethernet-Plus-Module-PoE+PD.pdf DCDC-Converter Silvertel Ag5810 single output DCDC-Converter, CINCON, EC6Cxx, dual or quad would add very little cost even without 1v/oct, could be other values, ceramic may work, test debouncing. Maybe enlarge footprint if needed. - Resistor footprint could stand to be larger than the object code. 4. You may add.

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