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13x8 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb15cc.pdf#page=119 ST WLCSP-52, ST die ID 479, 3.56x3.52mm, 64 Ball, 8x8 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100168.PDF XBGA-121, 11x11 raster, 10x10mm package, pitch 0.8mm; http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#p495 TFBGA-216.

• Normal -0.491817 -0.403621 0.771496 vertex -6.05401 6.05401.
• 0.338927 0.923209 vertex -3.44415 -8.31492 3.82299 facet.
• Normal -0.367809 0.00348095 0.929895 facet.

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