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System, 43045-1421 (alternative finishes: 43045-120x), 6 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSOP-I, 48 Pin (JEDEC MS-013AD, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_wide-rw/RW_24.pdf), generated with kicad-footprint-generator Net tie, 2 pin, 2.0mm square SMD pads Net tie, 2 pin, 0.5mm square SMD pads Net tie, 4 pin, 0.3mm round THT pads Net tie, 2 pin, 2.0mm square SMD pads Net tie, 2 pin, 1.0mm round THT pads Net tie, 4 pin, 1.0mm round THT pads Net tie, 3 pin, 1.0mm round THT pads Net tie, 4 pin, 1.0mm round THT pads Net tie, 3 pin, 1.0mm round THT pads Net tie, 2 pin, 0.3mm round THT pads Net tie, 4 pin, 0.3mm round THT pads Net tie, 4 pin, 0.5mm square SMD rectangular pad as test Point, diameter 1.5mm, hole diameter 1.85mm wire loop as test Point, diameter 1.0mm wire loop as test Point, square 4.0mm side length, hole diameter 1.5mm (loose fit), length 10.0mm solder Pin_ with flat fork, hole diameter 1.0mm test point wire loop as test Point, square 4.0mm side length SMD rectangular pad as test point, loop diameter2.548mm, hole diameter 0.7mm, length.

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