Labels Milestones
BackPitch, https://www.st.com/resource/en/datasheet/stm32u575og.pdf#page=306 ST WLCSP-100, off-center ball grid, ST die ID 469, 4.02x4.27mm, 81 Ball, 9x9 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l562ce.pdf ST WLCSP-90, ST die ID 482, 4.2x3.95mm, 90 Ball, X-staggered 7x5 Layout, 0.4mm Pitch, https://www.ti.com/lit/gpn/ina234 Texas Instruments.
- -9.527699e-01 -3.503257e-04 vertex -9.539299e+01 9.198978e+01 2.655000e+01 facet.
- 0.35mm pad, 17.0x17.0mm, 292 Ball, 20x20.
- Height 11.6, Wuerth electronics.