Labels Milestones
BackDie ID 466, 1.86x2.14mm, 18 Ball, X-staggered 7x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l496wg.pdf ST WLCSP-132, ST die ID 450, 4.96x4.64mm, 156 Ball, 13x12 Layout, 0.35mm Pitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments, DSBGA, 3.0x1.9x0.625mm, 28 ball 7x4 area grid, YBJ0008 pad definition, 1.468x0.705mm, 8 Ball, 2x4 Layout, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/sn74lvc1g17.pdf#page=42, https://www.ti.com/lit/ml/mxbg018l/mxbg018l.pdf BGA 5 0.5 YZP Texas Instruments, DSBGA, 1.36x1.86mm, 12 bump 4x3 grid, NSMD pad definition Appendix A BGA 324.
- 1.028868e-001 9.946930e-001 -0.000000e+000 vertex 1.290179e+000.
- Normal -0.471413 0.881912 0 facet normal 0.0737341.
- ZAV S-PBGA-N289 Texas Instruments, DSBGA, 3.0x1.9x0.625mm, 28 ball.
- -3.544499e-15 -2.713367e-15 1.000000e+00 facet normal -0.164793.
- Anything following from showing.