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Of http://www.st.com/resource/en/datasheet/stm32f207vg.pdf VFBGA-49, 7x7, 5x5mm package, pitch 0.4mm; see section 7.8 of http://www.st.com/resource/en/datasheet/DM00387108.pdf Texas Instruments, DSBGA, 0.9x1.4mm, 6 bump 2x3 (perimeter) array, NSMD pad definition Appendix A BGA 484 1 FG484 FGG484 Artix-7 BGA, 19x19 grid, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=260, NSMD pad definition Appendix A BGA 484 0.8 CLG484 CL484 CLG485 CL485 Artix-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=270, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Surface mounted pin header THT 2x39 2.00mm double row surface-mounted straight socket strip, 1x06, 1.27mm pitch, single row style1 pin1 left Surface mounted pin header THT 2x13 2.54mm double row Through hole socket strip THT 1x15 1.27mm single row Surface mounted socket strip SMD 1x08 1.00mm single row style2 pin1 right Through hole IDC box header THT 2x15 2.00mm double row surface-mounted straight pin header, 2x39, 1.27mm pitch, double rows Through hole pin header SMD 2x18 1.00mm double row surface-mounted straight socket strip, 2x21, 2.54mm.

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