Labels Milestones
BackTSSOP (4.4mm); Exposed Pad (see https://www.diodes.com/assets/Package-Files/SO-8EP.pdf 20-Lead Plastic Thin Shrink Small Outline Package (MS) [MSOP], variant of 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 5x-dip-switch SPST , Slide, row spacing 11.48 mm (451 mils 18-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 8-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 20-lead surface-mounted (SMD) DIP package, row spacing 8.9 mm (350 mils), SMDSocket, LongPads 5-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 10-lead surface-mounted (SMD) DIP package, row spacing 22.86 mm (900 mils), https://wiki.wemos.cc/products:d1:d1_mini, https://c1.staticflickr.com/1/734/31400410271_f278b087db_z.jpg DIN rail adapter universal three M3 clearance holes Mounting Hole 2.7mm, M2.5, ISO7380 mounting hole 3.2mm no annular m2 Mounting Hole 4.3mm, no annular, M2.5, DIN965 mounting hole 3.2mm m3 Mounting Hole 2.2mm, M2 mounting hole 6.5mm no annular m3 iso14580 Mounting Hole 2.7mm, no annular, M6, ISO7380 mounting hole 4.3mm m4 iso14580 Mounting Hole 4.3mm, no annular, M6, ISO14580 mounting hole 8.4mm no annular Mounting Hole 4.3mm, no annular, M5, DIN965 mounting.
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