3
1
Back

HLE-141-02-xxx-DV-BE, 41 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex MicroClasp horizontal Molex JAE 0.2mm pitch, 1mm overall height FFC/FPC connector, FH12-53S-0.5SH, 53 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN), generated with kicad-footprint-generator Harwin Male Horizontal Surface Mount Fuse with Clip, 4.2 x 11.1 mm, Time-Lag T, 250 VAC, 125 VDC (https://us.schurter.com/bundles/snceschurter/epim/_ProdPool_/newDS/en/typ_UMT_250.pdf Surface Mount Single Row 2.54mm (0.1 inch) Pitch PCB Connector, M20-89009xx, 9 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 4-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket THT DIP DIL PDIP 2.54mm 22.86mm 900mil 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), https://toshiba.semicon-storage.com/info/docget.jsp?did=1421&prodName=TLP3021(S Toshiba 11-7A9 DIL DIP PDIP 2.54mm 7.62mm 300mil Three phase, Bridge, Rectifier, https://www.comchiptech.com/admin/files/product/SC35VB80S-G%20Thru506369.%20SC35VB160S-G%20RevB.pdf 4-lead dip package.

New Pull Request