3
1
Back

Omron_A6S-310x, Slide, row spacing 7.62 mm (300 mils 22-lead surface-mounted (SMD) DIP package, row spacing 25.4 mm (1000 mils 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 14-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils SMD DIP DIL PDIP 2.54mm 26.669999999999998mm 1050mil SMDSocket LongPads 42-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/cvs.pdf SMD 4x-dip-switch SPST Copal_CHS-04A, Slide, row spacing 10.16 mm (400 mils), Socket 6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 6-lead.

New Pull Request