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BackFFV901 Artix-7, Kintex-7 and Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=298, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=94, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip SMD 2x26 2.54mm double row Through hole straight pin header, 2x07, 1.00mm pitch, single row style1 pin1 left Surface mounted socket strip SMD 1x22 2.54mm single row (from Kicad 4.0.7), script generated Through hole angled pin header, 2x34, 2.00mm pitch, 4.2mm pin length, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Surface mounted pin header SMD 2x31.
- Package RM2.54 package for Siemens SFH900.
- License Version 2.0 (the "License"); MIT License Copyright.
- Marked 1 nF\non first run.
- Normal 0.772994 -0.63014 0.0735159.
- Normal -0.816077 -0.545281 -0.191536.