Labels Milestones
BackFFV900 FF901 FFG901 FFV901 Artix-7, Kintex-7 and Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=268, NSMD pad definition Appendix A BGA 324 0.8 CS324 CSG324 BGA 324 0.8 CS324 CSG324 BGA 324 0.8 GateMate FPGA Maxim WLP-12, W121H2+1, 2.008x1.608mm, 12 Ball, 4x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l496wg.pdf ST WLCSP-132, ST die ID 479, 3.56x3.52mm, 64 Ball, 8x8 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100489.PDF WLCSP-25, 5x5 raster, 2.133x2.070mm package, pitch 0.4mm; see section 7.5.
- (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=274), generated with kicad-footprint-generator Molex Panelmate.
- "microvia_drill": 0.1, "name": "Default", "pcb_color": "rgba(0, 0, 0.
- -0.470887 0.880973 vertex 7.69994 3.18942.
- -4.792344e-001 -8.386599e-001 2.588127e-001 vertex.
- -1.011997e-14 5.429241e-15 -1.000000e+00 d8eca8dc7e.