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MSD, usually just one mallet; can play a lot of variations main MK_VCO/Panels/luther_triangle_vco.scad 274 lines HP = 5.07; // 5.07 for a single 0.127 mm² wire, basic insulation, conductor diameter 0.48mm, outer diameter 2mm, size source Multi-Contact FLEXI-E_0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 0.75 mm² wires, reinforced insulation, conductor diameter 1.7mm, size source Multi-Contact FLEXI-xV 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex LY 20 series connector, 53261-1771 (http://www.molex.com/pdm_docs/sd/532610271_sd.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0910, with PCB locator, 10 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex LY 20 series connector, B02B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 40 Pin (JEDEC MO-194 Var BB https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 53748-0708, 70 Pins (https://www.molex.com/pdm_docs/sd/537480308_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py HTSSOP56: plastic thin shrink small outline package; 28 leads; body width 7.5 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot369-1_po.pdf SSOP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_16_23.pdf, CP-16-23), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-107-02-xxx-DV-BE-LC, 7 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Soldered wire connection, for 4 times 0.25 mm² wires, reinforced insulation, conductor diameter 1.25mm, outer diameter 3.5mm, size 56x7.6mm^2, drill diamater 1.3mm, pad diameter 2.5mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00078_DB_EN.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_RND THT terminal block RND 205-00245, 6 pins, single row style1 pin1 left Surface mounted socket strip THT 2x49 1.27mm double row Through hole angled pin header, 2x24, 1.00mm pitch, double rows Through hole socket strip SMD 1x31 1.00mm single row Surface mounted socket strip SMD 2x08 2.54mm double row Through hole vertical IDC box header THT 2x17 2.54mm double row Through hole pin header THT 2x06 2.00mm double row surface-mounted straight socket strip, 2x28, 1.27mm pitch, single row Surface mounted socket strip THT 1x12 2.54mm single row Through hole angled pin header THT 1x12 2.54mm single row Through hole straight socket strip, 1x27, 1.27mm pitch, 4.4mm socket length, double rows Surface mounted pin header SMD 1x12 2.54mm single row (from Kicad 4.0.7), script generated Through hole pin header THT 2x25 2.54mm double row Through hole angled pin header, 2x11, 2.54mm pitch, 6mm pin length, double rows Surface mounted socket strip SMD 2x07 2.00mm double row Through hole pin header SMD 2x01 1.27mm double row Through hole IDC header, 2x20, 1.00mm pitch, 2.0mm pin length, double rows Surface mounted pin header SMD 1x24 1.00mm single row style2 pin1 right Through hole socket strip THT 2x29 2.54mm double row Through hole angled pin header THT 1x12 2.54mm single row.

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