Labels Milestones
Back1 FG484 FGG484 Artix-7 BGA, 18x18 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=279, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row Surface mounted socket strip SMD 1x08 2.00mm single row Surface mounted socket strip SMD Solder Jumper, 1x1.5mm rounded Pads, 0.3mm gap, open SMD Solder 3-pad Jumper, 1x1.5mm rounded Pads, 0.3mm gap, pads 1-2 bridged with 1 copper strip SMD 2x40 1.00mm double row surface-mounted straight pin header, 1x34, 1.00mm pitch, single row style1 pin1 left Surface mounted pin header SMD 2x19 1.00mm double row Through hole socket strip THT 2x06 2.00mm double row Through hole straight pin header, 1x36, 2.54mm pitch, single row style1 pin1 left Surface mounted socket strip THT 2x25 1.27mm double row Through hole angled pin header, 2x08, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 6.5mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole socket strip THT 1x02 2.54mm single row Through hole straight pin header, 2x05, 2.54mm pitch, double rows latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole IDC header, 2x15, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 12.0mm latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole straight pin header, 2x31, 1.27mm pitch, 4.0mm pin length, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip SMD 1x21 2.54mm single row Through hole straight pin header, 1x19, 1.00mm pitch.
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