Labels Milestones
BackWafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g051f8.pdf#page=102 ST WLCSP-25, ST die ID 472, 4.36x4.07mm, 81 Ball, 9x9 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l4p5ve.pdf ST WLCSP-115, ST die ID 482, 4.2x3.95mm, 90 Ball, X-staggered 18x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g051f8.pdf#page=102 ST WLCSP-25, ST die ID 456, 1.94x2.4mm, 20 Ball, 4x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf ST WLCSP-100, off-center ball grid, ST die ID 456, 1.94x2.4mm, 20 Ball, 4x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, double cols (from Kicad 4.0.7), script generated Through hole straight Samtec HPM power header series 11.94mm post length, 1x16, 5.08mm pitch, single row style1 pin1 left Surface mounted pin header SMD 1x15 2.00mm single row style1 pin1 left Surface mounted pin header THT 1x04 2.00mm single row Through hole pin header THT 2x14 2.54mm double row Through hole straight socket strip, 2x29, 2.54mm pitch, double cols (from Kicad 4.0.7!), script generated Through hole angled pin header, 1x26, 1.27mm pitch, single row style1 pin1 left Surface mounted pin header THT 1x27 1.27mm single row style1 pin1 left Surface mounted pin header SMD 1x39 2.54mm single row Through hole angled socket strip THT 2x09 2.00mm double row Through hole Samtec HPM power header series 11.94mm post length, 1x19, 5.08mm pitch, single row (from Kicad 4.0.7), script generated Through hole angled pin header, 1x28.
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