Labels Milestones
BackWith missing pin 7 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf.
- (http://www.ti.com/lit/ml/mpds579b/mpds579b.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect.
- 3.779778e-002 -4.777771e+000 2.488918e+001 facet.
- Grid, 21x21mm package, pitch.