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6-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 64-lead though-hole mounted DIP package, row spacing 7.62.

• FNR5045S, 5.0x5.0x4.5mm, https://datasheet.lcsc.com/lcsc/1806131217_cjiang-Changjiang-Microelectronics-Tech-FNR5040S3R3NT_C167960.pdf Inductor, Changjiang, FNR3012S, 3.0x3.0x1.2mm, https://datasheet.lcsc.com/lcsc/1806131217_cjiang-Changjiang-Microelectronics-Tech-FNR5040S3R3NT_C167960.pdf.
• (https://www.molex.com/pdm_docs/sd/2005280280_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger.
• (end 160.35 131.75 (end 181.6 131.75 (end.

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