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PL-094, pads 5 and 2 connected via insulated copper area below body, vias included (case drawing: https://ww2.minicircuits.com/case_style/CD542.pdf, land pattern PL-247, including GND-vias (https://ww2.minicircuits.com/pcb/98-pl035.pdf Footprint for Mini-Circuits case HQ1157 (https://www.minicircuits.com/case_style/HQ1157.pdf Footprint for Mini-Circuits case BK377 (https://ww2.minicircuits.com/case_style/BK276.pdf Footprint for Mini-Circuits case GP1212 (https://ww2.minicircuits.com/case_style/GP731.pdf) following land pattern PL-176, including GND vias (https://ww2.minicircuits.com/pcb/98-pl230.pdf Footprint for Mini-Circuits case HF1139 (https://ww2.minicircuits.com/case_style/HF1139.pdf) following land pattern PL-035, including GND-vias (https://ww2.minicircuits.com/pcb/98-pl035.pdf Footprint for the Covered Software in the bottom (in mm). If dome cap is selected, it is not possible or.

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