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DFN14, 4x4, 0.5P; CASE 506CN (see ON Semiconductor Micro8 (Case846A-02): https://www.onsemi.com/pub/Collateral/846A-02.PDF PSOP44: plastic thin shrink small outline package.

• 25x12.6mm^2, drill diamater 1.3mm, pad diameter 2.6mm.
• Hardware/Panel/precadsr_panel_al/precadsr_panel_al.sch create mode 100644 3D Printing/Panels/MAGIC.
• 100644 Hardware/PCB/precadsr/ao_tht.pretty/DIP-16_W7.62mm_Socket_LongPads.kicad_mod delete mode 100644.
• 4.041743e+000 -8.365688e-001 2.470218e+001 facet normal 5.000001e-001 8.660254e-001 -0.000000e+000.
• 3.78574 12.5787 facet normal -4.629302e-004 0.000000e+000.

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