Labels Milestones
BackBGA 1924 1 FF1926 FFG1926 FF1927 FFG1927 FFV1927 FF1928 FFG1928 FF1930 FFG1930 Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=269, NSMD pad definition Appendix A BGA 484 0.8 CLG484 CL484 CLG485 CL485 Artix-7 BGA, 18x18 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=80, NSMD pad definition (http://www.ti.com/lit/ml/mxbg270/mxbg270.pdf Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 4x3 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row style2 pin1 right Through hole angled pin header SMD 1x24 2.00mm single row Through hole angled pin header, 1x18, 1.27mm pitch, single row style2 pin1 right Through hole straight socket strip, 2x09, 1.27mm pitch, double rows Through hole angled pin header, 2x06, 2.54mm pitch, single row style1 pin1 left Surface mounted socket strip THT 1x02 2.00mm single row (https://gct.co/files/drawings/bc065.pdf), script generated Through hole angled socket strip, 2x35, 2.54mm pitch, single row Through hole angled pin header, 1x34, 1.00mm pitch, double rows Through hole angled socket strip, 2x26, 1.27mm pitch, 4.0mm pin length, double rows Through hole IDC header, 2x10, 1.00mm pitch, 2.0mm pin length, double cols (from Kicad 4.0.7), script generated Through hole pin header THT 2x39 2.54mm double row Through.
- 7.21514 -1.03118 7.67586 vertex 1.01854 -7.22332 7.61242 vertex.
- 2012/2 http://txccrystal.com/images/pdf/9ht11.pdf, hand-soldering, 2.0x1.2mm^2 package SMD Crystal EuroQuartz.
- Pitch 19.10mm diameter 21.8mm.