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0.5mm Fairchild-specific MicroPak2-6 1.0x1.0mm Pitch 0.35mm HVSON, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/20005474E.pdf#page=25), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP8: plastic thin shrink small outline package; 32 leads; body width 3.9 mm; lead pitch 0.65 mm (see NXP sot054_po.pdf TO-126-2, Horizontal, RM 1.27mm, Multiwatt-7, staggered type-1 TO-220-5, Horizontal, RM 1.7mm, MultiwattF-11, staggered type-2, see http://www.st.com/resource/en/datasheet/l298.pdf TO-220-15 Horizontal RM 2.286mm Plastic near cylindrical package Sod-70 see: https://www.nxp.com/docs/en/data-sheet/KTY81_SER.pdf [StepUp generated footprint] SOT-227 / SOT-227B / ISOTOP, M4 mounting hole 6.5mm no annular m3 Mounting Hole 3.2mm, M3 mounting hole 5.3mm no annular mounting hole 3.2mm m3 Mounting Hole 6.4mm, M6, ISO14580 mounting hole 2.7mm no annular m4 iso14580 Mounting Hole 4.3mm, no annular, M6, ISO14580 mounting hole 3.2mm no annular m5 Mounting Hole 6.4mm, no annular, M2.5, ISO14580 mounting hole 4.3mm no annular Mounting Hole 3.2mm, M3, ISO7380 mounting hole 6.4mm m6 Mounting.

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