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Connector, 41 top-side contacts, 0.5mm pitch, 1.854mm thermal pad HTSSOP32: plastic thin shrink small outline package; 56 leads; body width 4.4 mm; thermal pad TQFP64 7x7, 0.4P CASE 932BH (see ON Semiconductor Micro8 (Case846A-02): https://www.onsemi.com/pub/Collateral/846A-02.PDF PSOP44: plastic thin shrink small outline package; 14 leads; body width.

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