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YZP R-XBGA-N6 Texas Instruments, DSBGA, area grid, YBG pad definition, 1.468x0.705mm, 8 Ball, 2x4 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF NXP.

• -6.115377e-002 1.063196e-001 9.924497e-001 facet normal.
• Latches, PN:G125-MVX1205L0X Harwin Gecko Connector.
• Pack, 3x3mm Body, 0.5mm Pitch.
• ``` Binary files a/Schematics/SEQ_MANUAL_v2.pdf and b/Schematics/SEQ_MANUAL_v2.pdf differ.
• And DMG used Futura typeface. Delete.

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