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Mm (600 mils), SMDSocket, LongPads THT DIP DIL PDIP 2.54mm 11.43mm 450mil SMDSocket LongPads 4-lead though-hole mounted high-volatge DIP package (based on standard DIP-4), row spacing 8.9 mm (350 mils), SMDSocket, SmallPads 12-lead though-hole mounted DIP package, row spacing 11.43 mm (450 mils), SMDSocket, SmallPads 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size 6.7x9.18mm (see e.g. Http://www.ti.com/lit/ds/symlink/drv5023.pdf TO-92L leads in-line (large body variant of MSOP-16 (see https://www.analog.com/media/en/technical-documentation/data-sheets/3748fb.pdf MFSOP 4 pin SMD MSOP, 8 Pin (https://www.ti.com/lit/ds/symlink/lp2987.pdf#page=26), generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Straight solder pin 1.

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