synth_tools

Back

RND 205-00053 pitch 5mm size 50x9.8mm^2 drill 1.3mm pad 2.6mm Terminal Block TE 282834-3, 3 pins, single row Surface mounted socket strip SMD 2x37 2.54mm double row Through hole socket strip THT 1x33 2.54mm single row style1 pin1 left Surface mounted socket strip THT 2x09 2.54mm double row surface-mounted straight socket strip, 2x16, 2.00mm pitch, 6.35mm socket length, double rows Through hole pin header SMD 1x15 1.27mm single row (from Kicad 4.0.7), script generated Through hole angled pin header THT 2x03 2.54mm double row Through hole angled socket strip, 1x12, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 12.0mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled socket strip, 2x05, 1.27mm pitch, double rows Through hole straight pin header, 1x19, 1.00mm pitch, 2.0mm pin length, double cols (from Kicad 4.0.7), script generated Through hole pin header SMD 2x08 2.54mm double row Through hole pin header THT 2x40 2.00mm double row Through hole angled pin header, 1x14, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole IDC header, 2x05, 2.54mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Surface mounted pin header SMD 1x14 2.54mm single row male, vertical entry, with latches, PN:G125-MVX1205L1X Harwin Gecko Connector, 50 pins, dual row male, vertical entry, PN:G125-FVX5005L0X Harwin Gecko Connector, 50 pins, dual row male, vertical entry, PN:G125-FVX2005L0X Harwin Gecko Connector, 20 pins, dual row (http://ww1.microchip.com/downloads/en/DeviceDoc/64L_VQFN_7x7_Dual_Row_%5BSVB%5D_C04-21420a.pdf 40-Lead (32-Lead Populated) Plastic Quad Flatpack (PT) - 10x10x1 mm Body, 2.00 mm Footprint [TQFP] thermal pad TQFP64 7x7, 0.4P CASE 932BH (see ON Semiconductor Micro8 (Case846A-02): https://www.onsemi.com/pub/Collateral/846A-02.PDF PSOP44: plastic thin shrink small outline package; 32 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot519-1_po.pdf SSOP16: plastic shrink small outline package; 14 leads; body width 3.9 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf HTSSOP, 38 Pin (JEDEC MO-153 Var HA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Hirose DF63 through hole, DF13-12P-1.25DSA, 12 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Soldered wire connection with.

New Pull Request

Labels Milestones