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File edits README.md file 4f6e9e0984 Updated LICD, alter alt-textify to handle both title and alt tags elseif (strpos($article['link'], 'questionablecontent') !== FALSE) { elseif (strpos($article['content'], 'invisiblebread.com/2') !== FALSE) { $xpath = $this->get_xpath_dealie($article['link']); $article['content'] = $this->get_img_tags($xpath, '(//div[@id="comic"]//img)', $article) . $article['content']; elseif (strpos($article["link"], "drugsandwires.fail/dnwcomic/") !== FALSE) { // Three Panel Soul $xpath = new DOMXpath($doc); $imgs = $xpath->query('//img'); //doesn't get simpler than this foreach ($imgs as $img) { $article['content'] = $this->get_img_tags($xpath, "//img[starts-with(@src, '/comics/') and @class='comic_image']", $article); // Least I Could Do (wtf image size? Elseif (strpos($article['link'], 'campcomic.com/comic/') !== FALSE) { $xpath = $this->get_xpath_dealie($article['link']); $article['content'] = $this->get_img_tags($xpath, '(//div[@id="aftercomic"]//img)', $article); Assorted updates More layout updates created pull request 'new_footprints' (#5) from new_footprints into main 96f746fa2d Final tweaks, version submitted to JLCPCB on 20240124 Final tweaks, version submitted to Licensor for the Adafruit Feather M0 Wifi Footprint for Mini-Circuits case CD636 (https://ww2.minicircuits.com/case_style/CD636.pdf) following land pattern drawing: https://ww2.minicircuits.com/pcb/98-pl225.pdf Footprint for SSR made by Sharp Solid State relais SSR Sharp Sanyo SIP-15, 78.0mm x 8.0mm bosy size, STK-437E STK-439E STK-441E STK-443E (http://datasheet.octopart.com/STK430-Sanyo-datasheet-107060.pdf 8-Lead Plastic PSOP, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with missing pin 7 removed (Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Quad Flatpack - 10x10x2.5mm Body (http://www.onsemi.com/pub/Collateral/122BK.PDF PQFP80 14x20 / QIP80E CASE 122BS (see ON Semiconductor 506CN.PDF DC8 Package 8-Lead Plastic Dual Flat, No Lead Package (MD) - 4x4x0.9 mm Body [VDFN] (see Microchip Packaging Specification 00000049BS.pdf UQFN, 20 Pin (JEDEC MO-153 Var DB https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 6 times 2.5 mm² wires, basic insulation, conductor diameter 0.5mm, outer diameter 1.5mm, size source Multi-Contact FLEXI-xV 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 0.5 mm² wires, basic insulation, conductor diameter 2.4mm, see , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_MetzConnect THT terminal block RND 205-00249 pitch 10.2mm size.

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