Labels Milestones
BackGrid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=262, NSMD pad definition Appendix A Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=280, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row Surface mounted socket strip SMD 1x14 2.54mm single row Through hole straight socket strip, 2x18, 2.54mm pitch, 8.51mm socket length, double cols (from Kicad 4.0.7), script generated Surface mounted pin header THT 1x05 2.00mm single row Surface mounted socket strip THT 1x10 2.54mm single row Through hole angled pin header, 1x26, 1.27mm pitch, 4.4mm socket length, single row style1 pin1 left Surface mounted pin header THT 2x10 2.00mm double row Through hole socket strip SMD 1x06 1.27mm single row style2 pin1 right Through hole IDC header, 2x25, 1.00mm pitch, double rows Through hole angled socket.
- Setscrew hole, providing sufficient thread length where.
- Edge 9.12mm, see https://disti-assets.s3.amazonaws.com/tonar/files/datasheets/16730.pdf.