synth_tools

Back

And thermal vias; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f378vc.pdf WLCSP-72, 9x9 raster, 4.039x3.951mm package, pitch 0.8mm; https://www.nxp.com/docs/en/package-information/SOT1529-1.pdf Altera BGA-672 F672 FBGA WLP-15, 3x5 raster, 2.28x3.092mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l152zc.pdf UFBGA 132 Pins, 0.5mm Pitch, https://www.nxp.com/docs/en/package-information/98ASA00869D.pdf#page=1 MAPBGA 14x14x1.18 PKG, 14.0x14.0mm, 289 Ball, 17x17 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=23 FBGA-96, 13.5x7.5mm, 96 Ball, 9x16 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=24 FBGA-78, 10.5x8.0mm, 78 Ball, 9x13 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=25 FBGA-78, 10.5x9.0mm, 78 Ball, 9x13 Layout, 0.8mm Pitch, https://www.ti.com/lit/ml/mpbg777/mpbg777.pdf BGA 289 0.8 ZAV S-PBGA-N289 Texas Instruments, DSBGA, 1.36x1.86mm, 10 bump 3x4 (perimeter) array, NSMD pad definition Appendix A BGA 1156 1 RF1157 RF1158 Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=294, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=90, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias in pads, 4 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 30 Pin (JEDEC MO-153 Var EA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Connector Phoenix Contact, SPT 2.5/8-V-5.0-EX Terminal Block, 1990818 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1990818), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 28 Pin (package code T2844-1; https://pdfserv.maximintegrated.com/package_dwgs/21-0139.PDF), generated with kicad-footprint-generator ipc_noLead_generator.py LFCSP, 24 Pin (https://ams.com/documents/20143/36005/AS1115_DS000206_1-00.pdf), generated with kicad-footprint-generator Molex Mini-Fit Sr. Power Connectors, old mpn/engineering number: 5569-08A1, example for new part number: 26-60-5160, 16 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Hirose FH12, FFC/FPC connector, 50 bottom-side contacts, 1.0mm pitch, 1.0mm height, SMT, http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=84953&DocType=Customer+Drawing&DocLang=English&DocFormat=pdf&PartCntxt=84953-4 TE FPC connector, 39 top-side contacts, 0.5mm pitch, SMT, https://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F1734839%7FC%7Fpdf%7FEnglish%7FENG_CD_1734839_C_C_1734839.pdf%7F4-1734839-0 TE FPC connector, 07 top-side contacts, 0.5mm pitch, SMT, https://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F1734839%7FC%7Fpdf%7FEnglish%7FENG_CD_1734839_C_C_1734839.pdf%7F4-1734839-0 TE FPC connector, 10 top-side contacts, 0.5mm pitch, SMT, https://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F1734839%7FC%7Fpdf%7FEnglish%7FENG_CD_1734839_C_C_1734839.pdf%7F4-1734839-0.

New Pull Request

Labels Milestones