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Back05081707_A_DHD16.pdf DH Package; 16-Lead Plastic Small Outline (SS)-5.30 mm Body [UQFN]; (see Microchip Packaging Specification 00000049CH.pdf SC-74, 6 Pin (https://www.jedec.org/sites/default/files/docs/Mo-178c.PDF variant AA), generated with kicad-footprint-generator ipc_gullwing_generator.py 6-pin SOT-23 package, Handsoldering SOT, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/4440fb.pdf#page=13), generated with kicad-footprint-generator ipc_noLead_generator.py 4-lead though-hole mounted DIP package, row spacing 5.08 mm (200 mils), body size 10.8x4.1mm DIP Switch SPST Slide 5.25mm 206mil JPin SMD 7x-dip-switch SPST , Slide, row spacing 8.9 mm (350 mils), SMDSocket, LongPads 28-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, LongPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil 2x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils 48-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 14-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 12-lead though-hole mounted DIP package, row spacing 26.67 mm (1050 mils), SMDSocket, SmallPads 14-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm SMD DIP Switch SPST Slide 7.62mm 300mil LowProfile 1x-dip-switch SPST Copal_CHS-01A, Slide, row spacing 7.62 mm (300 mils), https://toshiba.semicon-storage.com/info/docget.jsp?did=1421&prodName=TLP3021(S Toshiba 11-7A9 package, like 6-lead dip package with missing pin 5, row spacing 6.73 mm (264 mils), body size 6.7x24.42mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 4x-dip-switch SPST , Slide, row spacing 16.51 mm (650 mils), SMDSocket, LongPads 6-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body.
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