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For LVDS, 2.33mm Height, Right Angle, Surface Mount, ZIF, Bottom Contact FFC/FPC, 200528-0130, 13 Circuits (https://www.molex.com/pdm_docs/sd/2005280130_sd.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 5273-11A example for new mpn: 39-30-0220, 11 Pins per row, Mounting: Snap-in Plastic Peg PCB Lock (http://www.molex.com/pdm_docs/sd/039300020_sd.pdf), generated with kicad-footprint-generator Hirose DF11 through hole, DF11-30DP-2DSA, 15 Pins per row (http://www.molex.com/pdm_docs/sd/022035035_sd.pdf), generated with kicad-footprint-generator JST VH side entry connector Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 502430-5010, 50 Pins per row (http://www.molex.com/pdm_docs/sd/530480210_sd.pdf), generated with kicad-footprint-generator Molex Micro-Fit 3.0 Connector System, 5267-12A, 12 Pins per row (https://www.molex.com/pdm_docs/sd/430450201_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 2 times 0.25 mm² wires, reinforced insulation, conductor diameter 0.65mm, outer diameter 2.3mm, see http://www.metz-connect.com/de/system/files/productfiles/Datenblatt_310591_RT063xxHBWC_OFF-022684T.pdf.

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