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Plastic SO, Exposed Die Pad (see Microchip Packaging Specification 00000049BS.pdf UQFN, 16 Pin (http://www.thatcorp.com/datashts/THAT_1580_Datasheet.pdf), generated with kicad-footprint-generator Soldered wire connection, for 6.

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For: MSTBVA_2,5/4-G; number of pins: 05; pin pitch.
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4.83166 8.72838 0.0386444 facet normal 0.00905415 -0.644981 0.764145.
0.365743 0.30016 0.880986 facet normal 0.0819028 0.0819649 -0.993264.

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