Labels Milestones
BackEnhanced Thin Shrink Small Outline Package (MS) [MSOP], variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 9.78x7.26mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 3x-dip-switch SPST , Slide, row spacing 9.53 mm (375 mils 18-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), LongPads 16-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 40-lead surface-mounted (SMD) DIP package, row spacing 5.25 mm (206 mils), body size 9.78x25.04mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 2x-dip-switch SPST , Slide, row spacing 10.16 mm (400 mils), LongPads 14-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 18-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 10.8x16.8mm 6x-dip-switch SPST KingTek_DSHP06TJ, Slide, row spacing 25.4 mm (1000 mils), LongPads 6-lead though-hole mounted DIP package.
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