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Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf Power-Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads THT DIP DIL.

• PCB, of minimum order size of circle.
• 3M 20-pin zero insertion.
• Connector, B32B-PHDSS (http://www.jst-mfg.com/product/pdf/eng/ePHD.pdf), generated with kicad-footprint-generator Molex Molex.

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