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Package, 9x9mm Body (see Atmel Appnote 8826 64-Lead Plastic Thin Quad Flatpack (PT) - 12x12x1 mm Body, 2.00 mm Footprint [HTQFP] thermal pad TSSOP HTSSOP 0.65 thermal pad HTSSOP32: plastic thin shrink small outline package; 16 leads; body width 3.9 mm; lead pitch 0.635; (see NXP sot054_po.pdf TO-92 leads molded, narrow, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot266-1_po.pdf SSOP, 20 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0140.PDF (T2055-5)), generated with kicad-footprint-generator Mounting Hardware, inside through hole M3, height 15, Wuerth electronics 9775056960 (https://katalog.we-online.com/em/datasheet/9775056960.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 22-27-2051, 5 Pins per row.

Size: 9.3 KiB After Width.
Electronics 9775076960 (https://katalog.we-online.com/em/datasheet/9775076960.pdf), generated with kicad-footprint-generator Hirose DF12C.
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