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Plastic QFN (3mm x 3mm) (see Linear Technology DFN_16_05-08-1706.pdf DHD Package; 18-Lead Plastic DFN (3mm x 2mm) (see Linear Technology DFN_6_05-08-1703.pdf 6-Lead Plastic DFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic Shrink Small Outline (SO) (http://www.everlight.com/file/ProductFile/201407061745083848.pdf 5-Lead Plastic Small Outline (SSO/Stretched SO), see https://www.vishay.com/docs/83831/lh1533ab.pdf SSO Stretched SO SOIC 1.27 SSO, 7 Pin Double Sided Module Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, single row (from Kicad 4.0.7), script generated Through hole socket strip SMD 2x40 2.54mm double row Through hole angled pin header SMD 1x08 2.54mm single row style1 pin1 left Surface mounted pin header THT 1x38 2.54mm single row Through hole straight socket strip, 2x33, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://www.tme.eu/Document/4baa0e952ce73e37bc68cf730b541507/T821M114A1S100CEU-B.pdf SMD vertical IDC header THT 1x03 1.27mm single row style1 pin1 left Surface mounted socket strip THT 1x14 2.00mm single row Surface mounted socket strip SMD 1x33 2.54mm single row Through hole straight pin header, 1x35, 2.54mm pitch, 6mm pin length, double rows Through hole pin header SMD 2x10 1.27mm double row Through hole angled pin header, 2x25, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole pin header THT 1x37 2.54mm single row Surface mounted pin header THT 1x26 2.00mm single row Surface mounted pin header THT 2x32 1.27mm double row Through hole IDC header, 2x06, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 6.5mm latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole horizontal.

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