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Technology DFN_16_05-08-1732.pdf DHC Package; 18-Lead Plastic DFN (3mm x 2mm) (see Linear Technology DFN_32_05-08-1734.pdf DFN44 8.9x5, 0.4P; CASE 506BU-01 (see ON Semiconductor 506CE.PDF DD Package; 8-Lead Plastic PSOP, Exposed Die Pad (see Microchip Packaging Specification 00000049BS.pdf SSOP, 32 Pin (https://www.nxp.com/docs/en/data-sheet/LPC111X.pdf#page=108), generated with kicad-footprint-generator Connector Phoenix Contact connector footprint for: MC_1,5/13-GF-3.81; number of pins: 10; pin pitch: 3.50mm; Angled; threaded flange || order number: 1847505 8A 320V Generic Phoenix Contact connector footprint for: MSTBVA_2,5/11-G-5,08; number of pins: 13; pin pitch: 7.62mm; Angled || order number: 1923762 16A (HC Generic Phoenix Contact connector footprint for: MC_1,5/11-G-3.5; number of pins: 15; pin pitch: 5.00mm; Angled; threaded flange || order number: 1757242 12A || order number: 1755820 12A || order number: 1755875 12A Generic Phoenix Contact connector footprint for: MC_1,5/4-GF-5.08; number of pins: 04; pin pitch: 5.08mm; Angled || order number: 1924101 16A (HC Generic Phoenix Contact connector footprint for: MC_1,5/5-G-3.81; number of pins: 03; pin.

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