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Size 6.7x11.72mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 10x-dip-switch SPST Omron_A6S-1010x, Slide, row spacing 7.62 mm (300 mils), see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf Power Integrations eDIP-12B, see https://www.power.com/sites/default/files/product-docs/linkswitch-pl_family_datasheet.pdf 4-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size 10.8x6.64mm 2x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 2x-dip-switch SPST KingTek_DSHP02TJ, Slide, row spacing 15.24 mm (600 mils), LongPads 6-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 10-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD DIP DIL PDIP 2.54mm 10.16mm 400mil LongPads 5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 22-pin zero insertion force socket, through-hole, row spacing 7.62 mm (300 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 32-pin zero insertion force socket, through-hole, row spacing 6.73 mm (264 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 9x-dip-switch SPST , Piano, row spacing 15.24 mm (600 mils), Socket 18-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 14-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 20-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x11.72mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 11x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 32-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 22-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil SMDSocket SmallPads 4-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 64-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 24-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils Toshiba 11-7A9 DIL DIP PDIP 5.08mm 2.54 4-lead dip package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, 4x4mm body, pitch 0.5mm, thermal vias in pads, 5 Pins per row.

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