Labels Milestones
BackBGA 400 0.8 CLG400 CL400 Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=298, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=94, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments EUS 5 Pin (https://www.jedec.org/sites/default/files/docs/Mo-178c.PDF variant BA), generated with kicad-footprint-generator JST PHD series connector, 78171-0003 (http://www.molex.com/pdm_docs/sd/781710002_sd.pdf), generated with kicad-footprint-generator Molex PicoBlade Connector System, 53048-0910, 9 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 2 times 0.5 mm² wire, reinforced insulation, conductor diameter 0.65mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-E/HK 0.127 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-1210, with PCB cutout, light-direction upwards, see http://www.kodenshi.co.jp/products/pdf/sensor/photointerrupter_ref/SG-105.pdf Laser Diode, TO-38-ICut.
- 3mm above panel, ample thunkicons: probably too.
- Vertical IDC box header THT 2x20.
- Normal 0.097471 0.989338 0.108209 vertex -5.48554 -1.87874.