3
1
Back

LFBGA-354, 16.0x16.0mm, 354 Ball, 19x19 Layout, 0.8mm Pitch, https://www.ti.com/lit/ml/mpbg777/mpbg777.pdf BGA 289 0.8 ZAV S-PBGA-N289 Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 4x3 grid, NSMD pad definition Appendix A Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=264, NSMD pad definition Appendix A BGA 1924 1 FL1925 FLG1925 FL1926 FLG1926 FL1928 FLG1928 FL1930 FLG1930 Artix-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=269, NSMD pad definition Appendix A BGA 900 1 FB900 FBG900 FBV900 Kintex-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=278, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=92, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, single row (from Kicad 4.0.7), script generated Through hole angled pin header THT 1x18 5.08mm single row Through hole IDC header, 2x06, 2.54mm pitch, double rows Through hole pin header THT 1x06 2.00mm single row Surface mounted socket strip SMD 1x25 2.00mm single row Through hole pin header THT 2x09 2.54mm double row surface-mounted straight pin header, 2x08, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole socket strip THT 2x06 2.00mm double row Through hole angled pin header, 1x07, 1.27mm pitch, 4.0mm pin length, single row Through hole straight pin header, 2x36, 2.00mm pitch, double rows Through hole straight socket strip, 1x36, 2.00mm pitch, double rows Surface mounted socket strip SMD 2x04 1.00mm double row surface-mounted straight socket strip, 2x09, 1.27mm pitch, 4.0mm pin length, double rows Through hole IDC.

New Pull Request