3
1
Back

2 connected via insulated copper area below body, vias included (case drawing: https://ww2.minicircuits.com/case_style/MMM168.pdf, land pattern drawing: https://ww2.minicircuits.com/pcb/98-pl094.pdf Footprint for Mini-Circuits case CK605 (https://ww2.minicircuits.com/case_style/CK605.pdf) following land pattern PL-236, including GND vias (https://ww2.minicircuits.com/pcb/98-pl079.pdf Footprint.

New Pull Request