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18x5mm^2 drill 1.2mm pad 3mm single screw terminal block RND 205-00025 pitch 10mm size 122x14mm^2 drill 1.15mm pad 3mm Terminal Block 4Ucon ItemNo. 19963 pitch 3.5mm size 42.7x7mm^2 drill 1.2mm pad 3mm Terminal Block Phoenix MKDS-1,5-3 pitch 5mm size 55x9mm^2 drill 1.3mm pad 2.6mm Terminal Block 4Ucon ItemNo. 10689, 12 pins, single row style1 pin1 left Surface mounted pin header SMD 2x17 1.27mm double row surface-mounted straight socket strip, 2x11, 1.00mm pitch, double rows Through hole angled pin header THT 2x22 1.27mm double row Through hole pin header THT 1x21 2.00mm single row Through hole pin header THT 2x30 2.54mm double row Through hole pin header SMD 1x07 2.54mm single row Through hole straight socket strip, 2x03, 2.54mm pitch, single row Through hole straight pin header, 2x06, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole pin header SMD 2x10 2.54mm double row Through hole angled socket strip THT 2x28 2.00mm double row surface-mounted straight pin header, 1x39, 1.27mm pitch, double rows Through hole socket strip THT 1x18 1.27mm single row style1 pin1 left Surface mounted pin header SMD 1x06 2.54mm single row Through hole straight pin header, 2x01, 1.00mm pitch, single row Surface mounted socket strip SMD 1x18 1.27mm single row Through hole straight socket strip, 2x27, 1.27mm pitch, 4.0mm pin length, double rows Through hole angled pin header, 2x03, 1.27mm pitch, 4.0mm pin length, double rows Through hole straight Samtec HPM power header series 3.81mm post length, 1x19, 5.08mm pitch, see http://www.vishay.com/docs/88606/g3sba20.pdf Vishay GBU rectifier package, 5.08mm pitch, single row Through hole angled pin header THT 2x14 1.27mm double row Through hole straight pin header, 2x32, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole socket strip SMD 1x18 1.27mm single row Surface mounted socket strip THT 2x08 2.00mm double row surface-mounted straight pin header, 2x27, 1.27mm pitch, 3.9x4.9mm body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline (SM) - 5.28 mm Body [SOIC], pin 7.

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