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FF1156 FFG1156 FFV1156 Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=276, NSMD pad definition Appendix A BGA 484 1 FB484 FBG484 FBV484 Artix-7, Kintex-7 and Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=273, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=284, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=84, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row style1 pin1 left Surface mounted pin header SMD 2x36 2.00mm double row Through hole angled pin header SMD 1x10 1.00mm single row style2 pin1 right Through hole angled socket strip THT 1x11 2.54mm single row style1 pin1 left Surface mounted pin header THT 1x33 2.54mm single row Surface mounted pin header THT 2x07 2.54mm double row surface-mounted straight socket strip, 2x45, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted pin header THT 1x40 1.00mm single row Through hole angled socket strip THT 2x35 2.54mm double row Through hole IDC header, 2x17, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Through hole angled socket strip THT 2x39 1.27mm double row surface-mounted straight pin header, 2x08, 2.54mm pitch, single row Through hole.

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