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55935-1310, with PCB locator, 13 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 4-Lead Plastic Small Outline Narrow Body (QR)-.150" Body [QSOP] (see Microchip Packaging Specification 00000049BS.pdf QFN Microchip 8E 16 QFN, 44 Pin, dual row male, vertical entry, strain relief clip Harwin LTek Connector, 44 pins, surface mount PLCC, 52 pins, surface mount PLCC, 68 pins, surface mount PLCC, 20 pins, through hole THT Omron Relay SPDT Finder 40.11 Relay DPDT Finder 40.51 Pitch 5mm relay dpdt fujitsu tht Kemet signal relay, DPDT, non-latching, single coil latching, https://content.kemet.com/datasheets/KEM_R7002_EC2_EE2.pdf Kemet EC2 signal relay DPDT double coil latching, https://content.kemet.com/datasheets/KEM_R7002_EC2_EE2.pdf Kemet EC2 signal relay DPDT double dual coil latching surface mount SMD package TO-269AA (e.g. Diode bridge), see https://diotec.com/tl_files/diotec/files/pdf/datasheets/mys40.pdf Diotec MicroDil diode bridge ABS (Diotec), see https://diotec.com/tl_files/diotec/files/pdf/datasheets/abs2.pdf SMD package for diode bridges, row spacing 7.62 mm (300 mils 18-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 3x-dip-switch SPST Copal_CVS-03xB, Slide, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 42-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 16-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 18-lead surface-mounted (SMD) DIP package, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 12-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 3x-dip-switch SPST KingTek_DSHP03TS, Slide, row spacing 26.67 mm (1050 mils), SMDSocket, SmallPads 28-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 10-lead though-hole mounted DIP package, row spacing 6.15 mm (242 mils), body size 6.7x16.8mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 9x-dip-switch SPST Omron_A6S-910x, Slide, row spacing 7.62 mm (300 mils), Socket, LongPads 20-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x24.42mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 10x-dip-switch SPST Copal_CHS-10B, Slide, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 48-lead though-hole mounted DIP package.

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