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TSSOP10: plastic thin shrink small outline package; 32 leads; body width 3.9 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot190-1_po.pdf VSSOP-8 2.3x2mm Pitch 0.5mm https://www.nxp.com/docs/en/application-note/AN10343.pdff Fairchild-specific MicroPak2-6 1.0x1.0mm Pitch 0.35mm https://www.nxp.com/docs/en/application-note/AN10343.pdff Fairchild-specific MicroPak-6 1.0x1.45mm Pitch 0.5mm right angle USB3 type.

2.3mm, size source Multi-Contact FLEXI-xV.
-0.115344 -0.000261241 0.993326 facet normal 0.471388 0.881926 6.69388e-06.
Printing/Panels/Radio_shaek_standoff_padded.stl create mode 100644 Hardware/PCB/precadsr/precadsr.pro delete.
0.634321 -0.011946 facet normal -0.766708 0.634279 0.0992472 facet.
0.247514 0.963781 0.0993082 facet normal -0.741889 -0.638745.

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