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Bump 3x3 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ml/mxbg270/mxbg270.pdf Texas Instruments, DSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD pad definition Appendix A BGA 1156 1 FF1157 FFG1157 FFV1157 FF1158 FFG1158 FFV1158 Virtex-7 BGA, 42x42 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=269, NSMD pad definition Appendix A Artix-7 and Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=289, NSMD pad definition Appendix A BGA 1924 1 FF1926 FFG1926 FF1927 FFG1927 FFV1927 FF1928 FFG1928 FF1930 FFG1930 Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=278, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=92, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, double rows Surface mounted socket strip SMD 2x23 1.00mm double row Through hole angled pin header, 2x17, 1.27mm pitch, 4.0mm pin length, single row Surface mounted pin header SMD 2x20 1.00mm double row Through hole angled socket strip SMD 2x19 2.00mm double row Through hole straight pin header, 1x26, 1.27mm pitch, 4.4mm socket length, double cols (from Kicad 4.0.7), script generated Through hole pin header SMD 1x30 1.00mm single row style1 pin1 left Surface mounted socket strip SMD 1x16 2.54mm single row Surface mounted socket strip THT 1x22 2.00mm single row style1 pin1 left Surface mounted socket strip SMD 1x18 2.54mm single row Surface mounted socket strip SMD 2x31 2.00mm double row Through hole straight.

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