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MC_1,5/16-G-3.81; number of pins: 16; pin pitch: 3.50mm; Vertical; threaded flange || order number: 1843745 8A 160V Generic Phoenix Contact connector footprint for: MCV_1,5/13-GF-3.5; number of pins: 15; pin pitch: 5.08mm; Vertical; threaded flange || order number: 1777206 12A Generic Phoenix Contact connector footprint for: GMSTBA_2,5/6-G; number of pins: 02; pin pitch: 7.62mm; Angled; threaded flange || order number: 1776935 12A || order number: 1843664 8A 160V Generic Phoenix Contact connector footprint for: MC_1,5/8-G-5.08; number of pins: 05; pin pitch: 7.62mm; Angled || order number: 1923869 16A (HC Generic Phoenix Contact connector footprint for: MSTBA_2,5/16-G; number of pins: 05; pin pitch: 5.08mm; Angled || order number: 1924486 16A (HC Generic Phoenix Contact SPT 2.5/2-H-5.0-EX Terminal Block, 1719309 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1719309), generated with kicad-footprint-generator ipc_noLead_generator.py Texas instruments QFN Package, datasheet: https://www.ti.com/lit/ds/symlink/tpsm53602.pdf Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 (perimeter) array, NSMD pad definition Appendix A BGA 225 0.8 CLG225 Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=307, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments EUW 7 Pin Double Sided Module Texas Instruments DSBGA BGA YZR0009 Texas Instruments, DSBGA, 3.415x3.535x0.625mm, 64 ball 8x8 area grid, NSMD pad definition Appendix A BGA 225 0.8 CLG225 Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=301, NSMD pad definition Appendix A Artix-7 BGA, 18x18 grid, 15x15mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=298, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=94, NSMD pad definition (http://www.ti.com/lit/ml/mpbg674/mpbg674.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf UCBGA-36, 6x6 raster, 2.553x2.579mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f051t8.pdf WLCSP-36, 6x6 raster, 2.605x2.703mm package, pitch 0.35mm; https://datasheets.maximintegrated.com/en/ds/MAX40200.pdf WLP-9, 1.448x1.468mm, 9 Ball, 3x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf Texas Instruments DSBGA BGA Texas Instruments, BGA Microstar Junior.

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