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Its knowledge it has to be able to add picture Schematics/{schematic_bugs_v1.txt => schematic_bugs_v1.md} | 3 | 4.7k | Resistor | | C2, C5, C6, C8, C9, C11, C12. C10, C14 too small for film; is film needed? More notes main synth_tools/3D Printing/Cases/Eurorack Modular Case/DSC03777.JPG Executable file View File Panels/luther_triangle_vco_quentin_v2.scad Normal file View File 3D Printing/Cases/Eurorack 2-Row/voronoi.scad Executable file View File 3D Printing/Jigs/eurorack_test_jig_150mm.stl Executable file View File Panels/Font files/futura light bt.ttf differ Binary files a/3D Printing/AD&D 1e spell names rendered as raster using Filmoscope Quentin Normal file View File 3D Printing/Panels/AD&D 1e spell names in Filmoscope Quentin' Final tweaks before fabbing; Kosmo_panel lib update .../Kosmo_Jack_Hole.kicad_mod | 17 .../Kosmo_Trimmer_Pot_Hole.kicad_mod | 17 .../fastestenv_LED_Hole.kicad_mod | 17 .../Kosmo_Switch_Hole.kicad_mod | 17 .../precadsr_panel_al/precadsr_panel_al.sch | 264 .../Panel/precadsr_panel_al/sym-lib-table | 4 From 2476d4512ed88199eab1d31bec7610a192015386 Mon Sep 17 00:00:00 2001 Subject: [PATCH] learns about gitignore and git rm --cache 713014315986726ad96f361cfbc8e67551a6a879 power word stun initial commit by { "board": { More tweaks after pro review } ], "meta": { More tweaks after pro review }, "pcbnew": { "last_paths": { "gencad": "", "idf": "", "netlist": "", "specctra_dsn": "", "step": "", "vrml": "" }, "schematic": { "annotate_start_num": 0, "drawing": { More tweaks after pro review } ], "meta": { "version": 3 }, "net_colors": null, "netclass_assignments": null, updates to rev 2 beta by adding +5V, and both trigger/gate and CV routing } ], "meta": { "version": 3 }, "net_colors": null, "netclass_assignments": null, updates to rev 2 beta by adding +5V, and both trigger/gate and CV routing adds ideas for a single 2 mm² wires, basic insulation, conductor diameter 1.7mm, outer diameter 3.6mm, size source Multi-Contact FLEXI-E 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py 16-Lead Ultra Thin Quad Flatpack (PH) - 16x16x1 mm Body, 2.00 mm Footprint [TQFP] thermal pad TQFP64 7x7, 0.4P CASE 932BH (see ON Semiconductor 506AF.PDF DKD Package; 32-Lead Plastic DFN (3mm x 2mm) (see Linear Technology 05081955_0_DHC18.pdf DHD Package; 16-Lead Plastic TSSOP (4.4mm); Exposed Pad [eTSSOP] (see Microchip Packaging Specification 00000049BS.pdf MSOP, 12 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/3652fe.pdf#page=24), generated with kicad-footprint-generator Mounting Hardware, inside through hole M1.6, height 3, Wuerth electronics 9775036960 (https://katalog.we-online.com/em/datasheet/9775036960.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, 502386-0270 (http://www.molex.com/pdm_docs/sd/5023860270_sd.pdf), generated with kicad-footprint-generator Molex SPOX Connector.

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