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BackCSP BGA Chip-Scale Glass-Top WLCSP-8, 2.284x1.551mm, 8 Ball, 2x4 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, single row Surface mounted pin header SMD 2x25 1.27mm double row surface-mounted straight pin header, 2x27, 2.00mm pitch, 6.35mm socket length, double rows Through hole IDC box header, 2x06, 1.00mm pitch, double rows Through hole pin header SMD 2x39.
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