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And sot552-1_po.pdf 14-Lead Plastic Dual Flat, No Lead Package - 9x9 mm Body [SSOP] (see Microchip Packaging Specification 00000049BS.pdf SSOP, 32 Pin (JEDEC MO-153 Var DB https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 100 Pin (JEDEC MO-153 Var CA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Soldered wire connection, for 3 times 0.1 mm² wire, basic insulation, conductor diameter 0.9mm, outer diameter 2.3mm, size source Multi-Contact.

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