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Oval pads, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot370-1_po.pdf SSOP56: plastic shrink small outline package; 32 leads; body width 16.90 mm Power-Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 6.73.

SSOP, 16 Pin (https://www.ti.com/lit/ds/symlink/tpa6132a2.pdf#page=24), generated with kicad-footprint-generator Soldered.
Width 17.78mm Pulse F L_Toroid, Vertical series.
9.327794e+01 2.655000e+01 facet normal 9.966023e-001 8.236405e-002 0.000000e+000.
Normal 0.0630861 -0.0787267 -0.994898 vertex.

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