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8-Lead Very Thin Dual Flatpack No-Lead Package, 3x3mm Body (see Microchip Packaging Specification 00000049BS.pdf 20-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf DCB Package 8-Lead Plastic Dual Flat, No Lead Package (8MA2) - 2x3x0.6 mm Body [SOIC], pin 7 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 9.78x19.96mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 11x-dip-switch SPST , Slide, row spacing 5.08 mm (200 mils), body size 6.7x6.64mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf DIP Switch SPST Slide 5.25mm 206mil JPin SMD 4x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 48-lead though-hole mounted high-volatge DIP package (based on standard DIP-4), row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 10-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size 10.8x16.8mm 6x-dip-switch SPST Omron_A6S-610x, Slide, row spacing 7.62 mm (300 mils), LongPads 6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x14.26mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 4x-dip-switch SPST Copal_CHS-04B, Slide, row spacing 10.16 mm (400 mils), LongPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil 1x-dip-switch SPST , Slide, row spacing 10.16 mm (400 mils), LongPads 12-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 8-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf THT DIP DIL PDIP 2.54mm 16.51mm 650mil SMDSocket LongPads 4-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), SMDSocket, LongPads 24-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils Toshiba 11-7A9 DIL DIP PDIP 5.08mm 2.54 4-lead dip package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline (ST)-4.4 mm Body [UDFN] (See http://www.onsemi.com/pub/Collateral/NLSV2T244-D.PDF dfn udfn dual flat OnSemi VCT, 28 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/Atmel-9505-AT42-QTouch-BSW-AT42QT1060_Datasheet.pdf#page=28), generated with kicad-footprint-generator ipc_noLead_generator.py PowerPAK PowerPAK MLP44-24L (https://www.vishay.com/docs/78231/mlp44-24l.pdf W-PDFN, 8 Pin (http://www.ixysic.com/home/pdfs.nsf/www/IX4426-27-28.pdf/$file/IX4426-27-28.pdf), generated with kicad-footprint-generator Molex Mini-Fit Sr. Power Connectors, 105309-xx04, 4 Pins (https://www.molex.com/pdm_docs/sd/026604020_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger.

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